Semiconductor Grinders

The DXSG320 machine can complete three processes of a production line: polishing / single-side grinding / single-side grinding. It is capable of simultaneously grinding both sides of a silicon wafer, and due to its single-wafer grinding capability, data for each wafer is traceable. Additionally, the DXSG320 supports automated wafer transportation in production lines, offering significant advantages over polishing machines and grinding discs.

Request A Quote